LA-DS Series thermal silica gel pad functions and applications-DONGGUAN HUAYUE THERMAL TECHNOLOGY CO.,LTD_

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LA-DS Series thermal silica gel pad functions and applications

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Product details

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Warranty(Year)：1 Year

Product Specifications

Product Description

LA-DS has good thermal conductivity interstitial performance, the material itself has a certain degree of flexibility, double-sided self-adhesive, used to fill the other components of the PC board, the air gap between the heat sink, the metal shell and the base, well fit power devices and cooling aluminum or machine shell gap so as to achieve the best thermal conductivity and heat dissipation purposes, but also play a shock absorption, insulation, sealing and other effects

LA-DS120 Thermal silica performance parameters

Specification	Unit	Test methods	Test value
Color	/	/	Adjustable
Thickness	mm	ASTM-D374	0.3-12
Hardness	ShoreD	ASTM-D2240	10-45
Thermal Conductivity	W/mk	ASTM-E1530	1.2
Thermal impedance @0.5	℃in2/W	ASTM-E5470	0.6
Breakdown Voltage	KV/mm	ASTM-D149	≥4
Specific Gravity	g/cm3	ASTM-D792	2.0
Volume Resistivity	ΩCM	ASTM-D257	10¹⁵Ω
Flammability class	/	UL-94	UL94-VO
Application temperature	/	EN344	-40~+200
Tape Choose	/	/	/