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LA-DS Series thermal silica gel pad

MOQ : piece

Lead Time : Days

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Product details

Supply Ability

  • Warranty(Year):1 Year

Product Specifications

Product Description

LA-DS Series thermal silica gel pad function and application
LA-DS has good thermal conductivity interstitial performance, material itself has a certain degree of flexibility, double-sided self-adhesive, used to fill other components of PC board, air gap between heat sink, metal and base power devices can be a good fit with cooling aluminum or machine shell gap so as to achieve best thermal conductivity and heat dissipation purposes, and also play a shock absorption, insulation, sealing, etc. role
LA-DS320 performance parameters of thermal silica

specifications,

unit,

test methods

test value

Color

/

/

adjustable

Thickness,

mm

ASTM-D374

0.3-12

Markings & Designations,

ShoreD

ASTM-D2240

10-45

Thermal Conductivity

W / mk

ASTM-E1530

3.0

Thermal impedance@0.5℃ in2 / WASTM-E54700.6

, Breakdown Voltage

KV / mm

ASTM-D149

≥ 4

Specific Gravity

g/cm3

ASTM-D792

2.0

Volume Resistivity

ΩCM

ASTM-D257

10 15 Ω

, Flammability class

/

UL-94

UL94-VO

Application, temperature

/

EN344

-40 ~ +200

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