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LA-DS Series thermal silica gel pad function and application

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Product details

Supply Ability

  • Warranty(Year):1 Year

Product Specifications

Product Description

LA-ST phase change material properties:
thermal conductivity change materials is a new type of thermal conductivity of a mixture of a filler of high thermal conductivity and phase change compound patch materials, professional heat transfer interface for high-speed high-power processor, product is available in 50 degrees phase change from solid to liquid, so as to ensure fully wet surface of device and heat sink, to form a good thermal interface layer, thermal conductivity of phase change material has same as thermal silica films can be pre-molding is suitable for mounting device, but also with thermal grease, low thermal resistance characteristics, combined with perfect features

physical properties of table:

specifications,

unit,

test methods

LA-ST20

LA-ST25

LA-ST50

Color

/

/

pink red

yellow

gray

, Thermal impedance.

℃ in2 / W

ASTM-D5470

0.2

0.2

0.2

Specific Gravity

g/cm3

ASTM-D792

2.8

2.8

2.8

Volume Resistivity

ΩCM

ASTM-D257

107Ω

107Ω

107Ω

Thermal Conductivity

W / mk

ASTM-E1530

2.0

2.0

3.8

Thickness,

mm

ASTM-D374

0.1 ~ 0.2

0.1 ~ 0.2

of 0.1 ~~ 0.2

, phase change softening point

-

50

50

50

Application, temperature

EN344

-40 ~ +250

-40 ~ +250

-40 ~ +250
 

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